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Semi Conductors
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Semiconductor Manufacturing Pre-process
Stepper Device
- A device that prints circuit pattern data onto a wafer using light passed through a projection lens. High precision and rigidity are required when creating microscopic circuit patterns.
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- NV・HV・SV
- High rigidity reduces vibrations caused by repeated high acceleration and deceleration, which contributes to higher precision.
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Semiconductor Manufacturing Pre-process
Wafer Polishing Machine
- Polishes silicon wafers.Precise surface polishing is required for the wafer to have a mirror finish with high level of flatness.
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- SPB-KP
- Improves the surface polishing with outstanding rotational accuracy Angular contact bearing made high-speed rotation possible.
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Semiconductor Manufacturing Pre-process
Wafer Cleaning System
- A device that sprays chemical onto a wafer and cleans it by spinning.Single wafer cleaning system requires each components to be compact in order to save space within the system.
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- SPB-KP
- Both linear and rotational motion can be achieved with a compact mechanism. Exhibits high rigidity and is ideal for rotating cleaning sections.
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Semiconductor Manufacturing Pre-process
Wafer Transfer Device
- Moves silicon wafers.There are multiple processes in semiconductor manufacturing which requires accurate transfers and space saving between processes.
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- SPBR
- In addition to linear and rotational motion, precise positioning can be performed with a single axis contributing to space saving and transfer of parts.
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Semiconductor Manufacturing Post-process
Wafer Cutting Machines
- A device that sublimates and evaporates wafers using a laser to cut them.Stage performance is directly linked to machining performance, so speed, accuracy, and rigidity are all important factors.
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- NV・HV・SV
- Suitable for precision stages due to high rigidity and minimal fluctuations in dynamic friction.
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Semiconductor Manufacturing Post-process
Pick and Place Device
- A device that picks up parts, moves them onto a board, and places them in a predetermined position. It is necessary to quickly and accurately place hundreds of parts that are several millimeters in size.
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- SSP-AM
- Multiple spline nuts can be fitted into a limited space due to its compact size. Highly accurate rotational positioning is possible by the torque transmission from spline grooves.
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Semiconductor Manufacturing Post-process
Wire Bonder
- A device that connects electrically by connecting electrical terminals on a board with metal wires. The connection operation depends on the stage, and requires high speed, high precision, and accurate tracing of minuscule strokes.
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- NV
- Anti-creep systems for rolling elements and vibration reduction due to high rigidity contribute to higher speed and higher precision. The structure has extremely small fluctuations in dynamic friction, making it ideal for small and precise strokes.
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Semiconductor Manufacturing Post-process
Pressfit Terminal Insertion Machine
- A mounting machine that press-fits terminals onto a circuit board. When press-fitting a large number of terminals, the equipment needs to be fast.
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- NV
- The anti-creep cage allows assembly regardless of unit orientation. It supports high acceleration/deceleration motion and contributes to shortening the cycle time of the equipment.
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Semiconductor Manufacturing Post-process
Orthogonal Soldering Robot
- A device that automatically performs soldering work. Reproducibility of repeated movements is important. For this reason, each part is required to have high rigidity and high precision.
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- NV・HV・SV
- High rigidity and smooth linear motion enable precise movement of the soldering tip. The structure has a reduced height, contributing to compactness and weight reduction.
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Semiconductor Manufacturing Post-process
Orthogonal Soldering Robot
- A device that automatically performs soldering work. Reproducibility of repeated movements is important. For this reason, each part is required to have high rigidity and high precision.
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- SPBR
- Linear motion, rotary motion, and positioning are achieved with a single axis. Compact equipment design is possible compared to conventional 2-axis specifications.
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Semiconductor Manufacturing Post-process
Orthogonal Soldering Robot
- A device that automatically performs soldering work. Reproducibility of repeated movements is important. For this reason, each part is required to have high rigidity and high precision.
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- BG
- The combination of single-axis actuators enables highly practical and highly accurate work. The highly rigid BG type can suppress the moment displacement that tends to occur when mounted on a wall.
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