Semi Conductors

• • Semiconductor Pre-process

    Stepper Machine

    A device that prints circuit pattern data onto a wafer using light passed through a projection lens. High precision and rigidity are required when creating microscopic circuit patterns.

    Reduces vibration, contributing to higher speed and finer details.

    

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• • Semiconductor Pre-process

    Plasma Etching Machine

    Equipment designed to remove thin films formed on the wafer surface to create intricate circuit patterns.

    Supports vacuum environments. Our extensive lineup ensures the perfect, user-friendly solution for your needs.

    

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• • Semiconductor Pre-process

    Wafer Transfer Machine

    Moves silicon wafers. There are multiple processes in semiconductor manufacturing which requires accurate transfers and space saving between processes.

    3-in-1 functionality: Compact your transport systems.

    

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• • Semiconductor Pre-process

    Wafer Cleaning Machine

    This equipment cleans wafers by spraying chemical solutions while rotating. Compared to batch processing, single-wafer cleaning is a more space-efficient method; as miniaturization advances, there is an increasing demand for even greater compactness.

    A design that balances compactness with durability is achievable.

    

    

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• • Semiconductor Pre-process

    Sputtering Machine

    This equipment forms thin films by bombarding a metal target with ions; the physical force ejects atoms, which are then deposited onto the wafer. This process is typically performed within a high-vacuum chamber.

    Versatile functions powered by ball spline torque transmission.

    

    

    The SPR series includes ultra-compact sizes not offered by any other competitor.

    

    Extensive track record of providing customized solutions for the semiconductor equipment industry. We pride ourselves on our ability to handle small-to-medium lot customizations that other manufacturers often shy away from.

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• • Semiconductor Pre-process

    Wafer Polishing Machine

    Polishes silicon wafers. Precise surface polishing is required for the wafer to have a mirror finish with high level of flatness.

    NB Ball Splines are highly resistant to torque and offer exceptional durability.

    

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• • Semiconductor Pre-process

    Wafer Testing Machine

    This equipment measures wafer thickness without contact by sandwiching the wafer and applying laser irradiation from above and below. Its XY-axis movement enables thickness measurement at specific points across the surface.

    Precision table accuracy, powered by an actuator!

    

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• • Semiconductor Pre-process

    Prober

    This equipment verifies electrical performance by bringing probe needles into contact with semiconductor chips. As chips continue to miniaturize, achieving more compact and high-precision units becomes increasingly critical.

    Improve inspection reliability through precise probe positioning.

    

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• • Semiconductor Post-process

    Wafer Mounter

    This equipment applies and secures dicing tape to wafers to prevent chip scattering during the cutting process. It ensures smooth operation in subsequent stages, such as dicing and expanding.

    Achieving equipment downsizing and high-precision wafer positioning!

    

    

    

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• • Semiconductor Post-process

    Dicing Machine

    A device that sublimates and evaporates wafers using a laser to cut them. Stage performance is directly linked to machining performance, so speed, accuracy, and rigidity are all important factors.

    Minimize vibration to enhance cutting accuracy.

    

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• • Semiconductor Post-process

    Die Bonder

    This equipment mounts semiconductor chips onto substrates or lead frames. As chips become thinner, higher precision is required for the pick-up process to ensure damage-free handling.

    Empowering the achievement of advanced functionalities.

    

    

    

    

    

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• • Semiconductor Post-process

    Flip Chip Bonder

    This device inverts semiconductor chips cut from a wafer and mounts them directly onto a substrate or lead frame. It requires precise alignment between the chip electrodes and the substrate pads.

    Precision mounting through accurate θ positioning.

    

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• • Semiconductor Post-process

    Wire Bonder

    A device that connects circuits by connecting electrical terminals on a board with metal wires. The connection operation depends on the stage, and requires high speed, high precision, and accurate tracing of minuscule strokes.

    Unique anti-cage-creep mechanism enables high acceleration and deceleration!

    

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• • Semiconductor Post-process

    Test Handler

    This equipment transports assembled semiconductor devices to their final destination for end-of-line testing, including electrical characteristics and visual inspections. It also sorts and categorizes the devices based on the test results.

    Making transport more compact.

    

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• • Semiconductor Post-process

    Chip Mounter

    A device that picks up parts, moves them onto a board, and places them in a predetermined position. It is necessary to quickly and accurately place hundreds of parts that are several millimeters in size.

    The compact outer cylinder shape is ideal for side-by-side configurations.

    

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• • Semiconductor Post-process

    Orthogonal Soldering Robot

    A device that automatically performs soldering work. Reproducibility of repeated movements is important. For this reason, each part is required to have high rigidity and high precision.

    High rigidity and compact design: Meeting the challenge of substrate miniaturization!

    

    

    

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• • Semiconductor Post-process

    Pressfit Terminal Insertion Machine

    A mounting machine that press-fits terminals onto a circuit board. When press-fitting a large number of terminals, the equipment needs to be fast.

    Proprietary anti-cage-creep technology—built for high acceleration and deceleration.

    

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